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NEWS!

  • Photos available. Check your e-mail for link or contact us.
  • Final Program (including IBIS Summit) is available here.
  • Preliminary Program is available here.
  • Authors are kindly reminded that they must send their final papers in IEEEXplore compatible pdf form! Authors are also kindly reminded that one registration per paper is required in order to maintain the paper in the conference program.
  • If you are experiencing difficulties with the online payment try using Firefox.
  • Invoicing: an electronic receipt will be sent by email upon payment of your registration. Receipts signed by the General Chair will be available on site. If you also require a legal invoice you must explicitly request it at spi2019@sciencesconf.org  in the seven days following your registration.
  • Registration is now open! Take the time to read Registration Info before creating an account or loging at My Registration.
  • Deadline for paper submission extended. Final deadline: March 15th 2019
  • Authors of best-ranked papers (based on peer review and presentation at the workshop) will be invited to submit an extended manuscript for a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology. These submissions will be subjected to a regular peer review process.
  • Special session to be held at SPI2019: Emerging Substrate-Integrated Technologies. To be chaired by Dr. Anthony Ghiotto (Univ. of Bordeaux).

OVERVIEW

Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation. In view of last year's success, the Committee is looking forward to the 23rd Edition which will convene in the French Alps, in the charming town of Chambery, on the shores of the Bourget lake. The SPI2019 technical program will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN code and will appear in IEEE Xplore. On this web site you can find all information regarding the 23rd IEEE Workshop on Signal and Power Integrity. It is our pleasure to invite you to the conference and we look forward to meeting you in France!

ORGANIZED BY

 
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SPONSORED BY

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IEEE MTT-S
 
IEEE EMC
 
 Ville de Chambéry
 
GOLD sponsor
Keysight
 
SILVER sponsors
 
mentor

 rohde-schwarz

 

Other sponsors
 
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 IBIS

 

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